{"title":"Self-contained built-in-self-test/repair transceivers for interconnects in 3DICs","authors":"M. Aung, T. T. Kim","doi":"10.1109/APCCAS.2016.7804061","DOIUrl":null,"url":null,"abstract":"In this paper, we propose self-contained built-in-self-test/repair (BIST/R) solutions to improve the reliability of the direct face-to-face copper thermo-compression bonding A dual-mode transceiver is presented to operate either as an ohmic mode when the bonding has low resistance or as a capacitive coupling mode when the bonding is faulty showing high resistance.","PeriodicalId":6495,"journal":{"name":"2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)","volume":"7 1","pages":"640-641"},"PeriodicalIF":0.0000,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APCCAS.2016.7804061","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
In this paper, we propose self-contained built-in-self-test/repair (BIST/R) solutions to improve the reliability of the direct face-to-face copper thermo-compression bonding A dual-mode transceiver is presented to operate either as an ohmic mode when the bonding has low resistance or as a capacitive coupling mode when the bonding is faulty showing high resistance.
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