C. Falco, A. De Luca, S. Sarfraz, I. Haneef, J. Coull, S. Z. Ali, F. Udrea
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Abstract
This paper presents a multiphysic 3-D model of an SOI CMOS MEMS thermal wall shear stress sensor obtained using “Comsol Multiphysics”. It includes all the physical domains involved and their interaction. After a brief introduction, the device is presented and its working principle explained. The numerical model and the validation process are then described.
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