Model of ageing inception and growth from microvoids in polyethylene-based materials under AC voltage

G. Montanari, A. Cavallini, L. Testa, S. Serra, L. Dissado
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引用次数: 16

Abstract

Several degradation mechanisms may affect polymeric insulation system reliability. Some authors postulate that, even in a perfect dielectric, nanoscale cavities can enlarge due to various mechanisms (from mechanical fatigue to lowering of the degradation reaction energy barrier) up to a point where highly energetic phenomena, which bring about breakdown, can be incepted. Other authors are more focused on the inherent limits of manufacturing processes, which leave cavities within the insulation system whose size is large enough to cause electron avalanches, thus a measurable partial discharge (PD) activity, from the time the system is put in service or as a function of external factors (e.g. mechanical damage, thermal shrinking, overvoltages). Given the time scale of polymeric system failures, this latter mechanism seems to be more plausible. It is therefore worthwhile to investigate in depth the degradation rates associated with PD in micrometric cavities in polymeric insulation systems subjected to AC voltage. The proposed model is based on damage accumulation on cavity surfaces caused by PD phenomena. The main degradation mechanism associated with PD is considered to be the hot-electron induced bond-breaking process. This process accumulates with time, leading to the creation of a damaged region of critical size and, ultimately, to breakdown. The proposed model describes the defect induction and growth phase until treeing phenomena start, which is, normally, the largely prevailing component of breakdown time.
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交流电压下聚乙烯基材料微孔老化开始和生长的模型
几种降解机制可能影响聚合物绝缘系统的可靠性。一些作者假设,即使在完美的电介质中,纳米级空腔也会由于各种机制(从机械疲劳到降解反应能垒的降低)而扩大,直到可以接受导致击穿的高能量现象。其他作者更关注制造过程的固有限制,这些限制会在绝缘系统内留下足够大的空腔,从而导致电子雪崩,从而从系统投入使用或作为外部因素(例如机械损伤,热收缩,过电压)的函数产生可测量的局部放电(PD)活动。考虑到聚合物系统失效的时间尺度,后一种机制似乎更合理。因此,有必要深入研究在交流电压作用下聚合物绝缘系统微腔中与PD相关的降解率。该模型基于局部放电现象引起的腔体表面损伤累积。与钯相关的主要降解机制被认为是热电子诱导的断键过程。这个过程随着时间的推移而累积,导致一个临界大小的受损区域的产生,并最终崩溃。该模型描述了缺陷的诱导和生长阶段,直到树形现象开始,这通常是击穿时间的主要组成部分。
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