Thermal Annealing of Gold Thin Films on the Structure and Surface Morphology Using RF Magnetron Sputtering

M. Syed, C. Glaser, C. Hynes, M. Syed
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引用次数: 3

Abstract

Gold (Au) thin films were deposited on SiO2 substrate under argon (Ar) gas environment using RF (radio frequency) magnetron sputtering at room temperature for various deposition times. These samples have been annealed at the temperature range of 250-450 °C. The change of the structural and surface morphological properties of both as-deposited and annealed films has been studied using an AFM (atomic force microscope), XRD (X-ray diffraction) and Raman scattering. The improvement of crystallinity was observed at the annealing temperature of 350 °C and degradation was found thereafter. In agreement with XRD and Raman measurements, both crystallite size and crystalline volume fraction were found to be increased having maximum at 350 °C and decreased afterward. This result can be explained by simple kinetic theory where sticking probabilities, Au structures agglomerated on SiO2 surfaces and surface coverage of Au atoms must be considered. Moreover, it can also be explained by the occurrence of two competing phenomena like roughening induced grain growth and smoothing induced inhibition of grain growth with increasing annealing time. Growth mechanisms are also discussed.
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射频磁控溅射热退火对金薄膜结构和表面形貌的影响
在室温氩气环境下,采用射频磁控溅射技术,在不同沉积时间下在SiO2衬底上沉积金(Au)薄膜。这些样品在250-450°C的温度范围内退火。采用原子力显微镜(AFM)、x射线衍射仪(XRD)和拉曼散射仪(Raman scattering)研究了沉积膜和退火膜的结构和表面形貌的变化。在350℃的退火温度下,结晶度得到改善,之后出现了降解现象。XRD和Raman测试结果表明,晶体尺寸和晶体体积分数在350℃时增大最大,之后减小。这一结果可以用简单的动力学理论来解释,其中必须考虑粘附概率、Au结构在SiO2表面的聚集和Au原子的表面覆盖。此外,随着退火时间的延长,晶粒生长受到粗化诱导和平滑抑制这两种相互竞争的现象的影响。还讨论了生长机制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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