Low-dielectric-constant novel periodic mesoporous organosilica thin film for interlayer dielectric

Abstract

A low-dielectric-constant organosilica was developed for interlayer dielectric, introducing adamantane which possesses low polarity and unique rigid structure. Novel organosilane precursor, adamantane-bridged organosilane precursor, was synthesized and characterized. Precursor was mixed with porogen P123, acid and ethanol to prepare coating solution, and the novel periodic mesoporous organosilica (PMO) thin film was prepared via evaporation-induced self-assembly method. The PMO thin film presents ultra-low dielectric constants (1.56@1 MHz) and high Young's modulus (6.69±0.54 GPa) via optimizing the porogen content, besides it shows order structure and hydrophobic property.