Temperature Robust Silicon Resonant Accelerometer with Stress Isolation Frame Mounted on Axis-Symmetrical Anchors

J. Cui, Mengxia Liu, Haibing Yang, Dong Li, Qiancheng Zhao
{"title":"Temperature Robust Silicon Resonant Accelerometer with Stress Isolation Frame Mounted on Axis-Symmetrical Anchors","authors":"J. Cui, Mengxia Liu, Haibing Yang, Dong Li, Qiancheng Zhao","doi":"10.1109/MEMS46641.2020.9056157","DOIUrl":null,"url":null,"abstract":"This paper presents a novel silicon resonant accelerometer (SRA) with a stress isolation frame mounted on axis-symmetrical anchors to improve the temperature performance. The stress-insensitive design prevents the thermal stress produced by the mismatch of the thermal expansion coefficients (CTE) of the heterogeneous materials in the device from transmitting to double-ended tuning forks (DETF), resulting in reducing the thermal sensitivity of SRA. The results show the scale factor is 516 Hz/g and the average nominal frequency of the two DETFs is ∼138.4 kHz with the closely matched temperature coefficients of frequency (TCF) 5.72 Hz/°C and 5.92 Hz/ °C, respectively. The bias thermal sensitivity and compensated stability are 0.42 mg/°C and 0.6 mg over the temperature range from −40 °C to 40 °C, which is competitive compared with previously reported results in literatures.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"10 1","pages":"791-794"},"PeriodicalIF":0.0000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMS46641.2020.9056157","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

This paper presents a novel silicon resonant accelerometer (SRA) with a stress isolation frame mounted on axis-symmetrical anchors to improve the temperature performance. The stress-insensitive design prevents the thermal stress produced by the mismatch of the thermal expansion coefficients (CTE) of the heterogeneous materials in the device from transmitting to double-ended tuning forks (DETF), resulting in reducing the thermal sensitivity of SRA. The results show the scale factor is 516 Hz/g and the average nominal frequency of the two DETFs is ∼138.4 kHz with the closely matched temperature coefficients of frequency (TCF) 5.72 Hz/°C and 5.92 Hz/ °C, respectively. The bias thermal sensitivity and compensated stability are 0.42 mg/°C and 0.6 mg over the temperature range from −40 °C to 40 °C, which is competitive compared with previously reported results in literatures.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
温度稳健硅谐振加速度计与应力隔离框架安装在轴对称锚
本文提出了一种新型硅谐振加速度计(SRA),该加速度计的应力隔离框架安装在轴对称锚上,以提高温度性能。应力不敏感设计防止了器件中非均质材料的热膨胀系数(CTE)不匹配产生的热应力传递到双端音叉(DETF),从而降低了SRA的热敏性。结果表明,两种detf的标度因子为516 Hz/g,平均标称频率为~ 138.4 kHz,频率(TCF)温度系数分别为5.72 Hz/°C和5.92 Hz/°C。在−40°C至40°C的温度范围内,偏热敏度和补偿稳定性分别为0.42 mg/°C和0.6 mg/°C,与先前文献报道的结果相比具有竞争力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
The Shear Modulus Determination via Quartz Crystal Resonator for Graphene Oxide Film Prepared by Drop Casting A Compact Microcontroller-Based MEMS Rate Integrating Gyroscope Module with Automatic Asymmetry Calibration Super High Frequency Simple Process Flow Cross-Sectional Lamé Mode Resonators in 20% Scandium-Doped Aluminum Nitride Robust and Sensitive Sensing of Unsteady Flows Using a Hair-Like Macroscopic Graphene Fiber Microelectromechanical Switch with Carbon Nanotube Arrays for High-Temperature Operation
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1