Precision Evaluation of Large Payload SCARA Robot for PCB Assembly

IF 1 Q4 ENGINEERING, MANUFACTURING Journal of Micro and Nano-Manufacturing Pub Date : 2022-06-27 DOI:10.1115/msec2022-85534
Andrew S. Nimon, A. Sherehiy, Moath H. A. Alqatamin, Danming Wei, D. Popa
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Abstract

The placement of SMD components is usually performed with Cartesian type robots, a task known as pick-and-place (P&P). Small Selective Compliance Articulated Robot Arm (SCARA) robots are also growing in popularity for this use because of their quick and accurate performance. This paper describes the use of the Lean Robotic Micromanufacturing (LRM) framework applied on a large, 10kg payload, industrial SCARA robot for PCB assembly. The LRM framework guided the precision evaluation of the PCB assembly process and provided a prediction of the placement precision and yield. We experimentally evaluated the repeatability of the system, as well as the resulting collective errors during the assembly. Results confirm that the P&P task can achieve the required assembly tolerance of 200 microns without employing closed-loop visual servoing, therefore considerably decreasing the system complexity and assembly time.
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大载荷SCARA机器人PCB装配精度评价
SMD组件的放置通常由笛卡尔型机器人执行,这是一项被称为拾取放置(P&P)的任务。小型选择性合规铰接式机械臂(SCARA)机器人也越来越受欢迎,因为它们的快速和准确的性能。本文描述了将精益机器人微制造(LRM)框架应用于大型10kg有效载荷的工业SCARA PCB组装机器人。LRM框架指导了PCB装配过程的精度评估,并提供了放置精度和成品率的预测。我们通过实验评估了系统的可重复性,以及组装过程中产生的集体误差。结果表明,在不采用闭环视觉伺服的情况下,P&P任务可以达到200微米的装配公差要求,从而大大降低了系统的复杂性和装配时间。
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来源期刊
Journal of Micro and Nano-Manufacturing
Journal of Micro and Nano-Manufacturing ENGINEERING, MANUFACTURING-
CiteScore
2.70
自引率
0.00%
发文量
12
期刊介绍: The Journal of Micro and Nano-Manufacturing provides a forum for the rapid dissemination of original theoretical and applied research in the areas of micro- and nano-manufacturing that are related to process innovation, accuracy, and precision, throughput enhancement, material utilization, compact equipment development, environmental and life-cycle analysis, and predictive modeling of manufacturing processes with feature sizes less than one hundred micrometers. Papers addressing special needs in emerging areas, such as biomedical devices, drug manufacturing, water and energy, are also encouraged. Areas of interest including, but not limited to: Unit micro- and nano-manufacturing processes; Hybrid manufacturing processes combining bottom-up and top-down processes; Hybrid manufacturing processes utilizing various energy sources (optical, mechanical, electrical, solar, etc.) to achieve multi-scale features and resolution; High-throughput micro- and nano-manufacturing processes; Equipment development; Predictive modeling and simulation of materials and/or systems enabling point-of-need or scaled-up micro- and nano-manufacturing; Metrology at the micro- and nano-scales over large areas; Sensors and sensor integration; Design algorithms for multi-scale manufacturing; Life cycle analysis; Logistics and material handling related to micro- and nano-manufacturing.
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