Electrical Properties of Rapidly Annealed Ir and Ir/Au Schottky Contacts on n-Type InGaN

V. Reddy, B. Prasanna Lakshmi, R. Padma
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引用次数: 13

Abstract

The effect of annealing temperature on electrical characteristics of iridium (Ir) and iridium/gold (Ir/Au) Schottky contacts to n-type InGaN have been investigated by means of current-voltage (I-V) and capacitance-voltage (C-V) techniques. It is observed that the barrier height of Ir/n-InGaN and Au/Ir/n-InGaN Schottky diodes increases after annealing at 300∘C for 1 min in N2 ambient compared to the as-deposited. However, the barrier heights are found to be decreased somewhat after annealing at 500∘C for the both Ir and Ir/Au Schottky contacts. From the above observations, it is clear that the optimum annealing temperature for both Ir and Ir/Au Schottky contacts is 300∘C. Moreover, the barrier height (𝜙𝑏), ideality factor (n) and series resistance (𝑅𝑆) are determined using Cheung’s and Norde methods. Besides, the energy distribution of interface state densities are determined from the forward bias I-V characteristics by taking into account the bias dependence of the effective barrier height. Based on the above results, it is clear that both Ir and Ir/Au Schottky contacts exhibit a kind of thermal stability during annealing.
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n型InGaN上快速退火Ir和Ir/Au肖特基触点的电学特性
采用电流-电压(I-V)和电容-电压(C-V)技术研究了退火温度对n型InGaN上铱(Ir)和铱/金(Ir/Au)肖特基触点电学特性的影响。观察到Ir/n-InGaN和Au/Ir/n-InGaN肖特基二极管在300°C N2环境下退火1 min后,势垒高度比沉积时有所增加。然而,在500°C下退火后,Ir和Ir/Au肖特基接触的势垒高度有所下降。从上述观察可以清楚地看出,Ir和Ir/Au肖特基触点的最佳退火温度都是300°C。此外,利用Cheung和Norde的方法确定了势垒高度(𝑏)、理想因子(n)和串联电阻(𝑅𝑆)。此外,考虑有效势垒高度的偏置依赖性,从正向偏置I-V特性确定了界面态密度的能量分布。基于上述结果,可以清楚地看出Ir和Ir/Au肖特基触点在退火过程中表现出一种热稳定性。
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