Enhance the gas-sensing performances of graphene oxide (GO) thin films for detecting nitrogen dioxide gas

A. Al-Jawdah, Rathyah Jarrah, Mohsin K Al-Khaykanee, Mirjam Skof
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Abstract

In this work, graphene oxide (GO) synthesized via a modified Hummer method was utilized to manufacture thin films for gas sensor applications. The films were prepared on glass substrates using the spin coating technique, the concentration of GO was varied in the precursor liquid. The crystall ographic properties of the prepared GO films were analyzed using XRD and the results showed a polycrystalline structure with a crystallite size of 15.51 nm. Using the weighing method, the average film thickness was determined to be about 200 nm. UV-Vis absorption spectrometry combined with the Tauc method confirmed the indirect nature (allowed and forbidden) of electronic transitions in the samples and it also showed a decrease in the optical energy gap with an increasing amount of GO in the samples. Values for Eg ranged from 2.4 eV to 2.15 eV for allowed transitions and from 3.05 eV to 2.6 eV for forbidden transitions. Gas sensing measurements were performed using NO2 as target gas at different operating temperatures (50, 100, 200 and 300 oC), as well as four target gas concentration (100 ppm, 400 ppm, 700 ppm, and 1000 ppm) have been tested and shows the good response in the range of 10%. It can be seen that the sensitivity increases with increasing operating temperature and gas concentration. At 300 oC operating temperature response and recovery time decrease to their lowest value or 2.6 and 5 seconds, respectively.
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提高氧化石墨烯(GO)薄膜检测二氧化氮气体的气敏性能
在这项工作中,通过改进的Hummer方法合成的氧化石墨烯(GO)被用于制造用于气体传感器应用的薄膜。采用自旋镀膜技术在玻璃基板上制备了氧化石墨烯薄膜,改变了前驱液中氧化石墨烯的浓度。用XRD对制备的氧化石墨烯薄膜进行了晶体形貌分析,结果表明制备的氧化石墨烯薄膜为多晶结构,晶粒尺寸为15.51 nm。采用称重法测定膜的平均厚度约为200 nm。UV-Vis吸收光谱结合Tauc法证实了样品中电子跃迁的间接性质(允许和禁止),并且随着样品中GO含量的增加,光学能隙减小。对于允许的跃迁,Eg的值从2.4 eV到2.15 eV,对于禁止的跃迁,Eg的值从3.05 eV到2.6 eV。在不同的工作温度(50、100、200和300℃)下,以二氧化氮为目标气体进行了气敏测量,并测试了四种目标气体浓度(100 ppm、400 ppm、700 ppm和1000 ppm),在10%的范围内表现出良好的响应。可以看出,灵敏度随工作温度和气体浓度的增加而增加。在300℃工作温度下,响应和恢复时间分别降至2.6秒和5秒的最低点。
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