CMOS-MEMS thermoelectric generator for low power medical devices

Z. H. A. Rahman, M. H. M. Md Khir, Z. A. Burhanudin
{"title":"CMOS-MEMS thermoelectric generator for low power medical devices","authors":"Z. H. A. Rahman, M. H. M. Md Khir, Z. A. Burhanudin","doi":"10.1109/RSM.2015.7354965","DOIUrl":null,"url":null,"abstract":"This paper presents the design and simulation of a new concept of CMOS-MEMS thermoelectric generator (TEG) capable of converting thermal energy into electrical energy for use in low power medical devices. The TEG is designed with three unique features that will ensure optimum heat transfer that result in achievement of larger temperature difference between two junctions. First, a thicker dielectric layer is designed between two metal layers. Second, trenches isolation is introduced to isolate the hot and cold junction area. Third, thermal insulator and heat sink layer are deposited on the top surface of the TEG at the hot and cold junction area, respectively. Based on the simulation results of these three abovementioned features, a device with size of 25 mm2 consisting of 1712 thermocouples with 5 K temperature difference between two sides, is capable of producing output voltage and power of 3.294 V and 0.925 μW, respectively. Voltage factor is 2.635 Vcm-2K-1 and power factor is 0.148 μWcm-2K-2.","PeriodicalId":6667,"journal":{"name":"2015 IEEE Regional Symposium on Micro and Nanoelectronics (RSM)","volume":"78 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE Regional Symposium on Micro and Nanoelectronics (RSM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RSM.2015.7354965","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

This paper presents the design and simulation of a new concept of CMOS-MEMS thermoelectric generator (TEG) capable of converting thermal energy into electrical energy for use in low power medical devices. The TEG is designed with three unique features that will ensure optimum heat transfer that result in achievement of larger temperature difference between two junctions. First, a thicker dielectric layer is designed between two metal layers. Second, trenches isolation is introduced to isolate the hot and cold junction area. Third, thermal insulator and heat sink layer are deposited on the top surface of the TEG at the hot and cold junction area, respectively. Based on the simulation results of these three abovementioned features, a device with size of 25 mm2 consisting of 1712 thermocouples with 5 K temperature difference between two sides, is capable of producing output voltage and power of 3.294 V and 0.925 μW, respectively. Voltage factor is 2.635 Vcm-2K-1 and power factor is 0.148 μWcm-2K-2.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
用于低功耗医疗设备的CMOS-MEMS热电发电机
本文介绍了一种新的CMOS-MEMS热电发生器(TEG)的设计和仿真,该热电发生器能够将热能转化为电能,用于低功耗医疗设备。TEG设计具有三个独特的功能,可确保最佳的传热,从而实现两个结之间的较大温差。首先,在两个金属层之间设计一个较厚的介电层。其次,引入沟槽隔离,隔离冷热接点区域。第三,在TEG的上表面热端和冷端区域分别沉积隔热层和散热器层。基于上述三个特性的仿真结果,一个由1712个热电偶组成、两侧温差为5 K、尺寸为25 mm2的器件可以分别产生3.294 V和0.925 μW的输出电压和功率。电压因数为2.635 μ wcm - 2k -1,功率因数为0.148 μWcm-2K-2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Investigation on Optical Interconnect(OI) link performance using external modulator Modeling and simulation of polysilicon piezoresistors in a CMOS-MEMS resonator for mass detection FPGA-based hardware-in-the-loop verification of dual-stage HDD head position control A comparative study of photocurable sensing membrane for Potassium ChemFET sensor The vertical strained impact ionization MOSFET (VESIMOS) for ultra-sensitive biosensor application
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1