Impact of high-k dielectric on the digital and analog performance on emulation of double-gate UTBB SOI MOSFETs with different ground plane structures

N. Othman, M. Arshad, S. Sabki, U. Hashim
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引用次数: 1

Abstract

In this work, we investigate the impact of using different gate dielectric materials i.e HfO2 and Si3N4 as compared to the conventional SiO2 with equivalent oxide thickness (EOT) of 1.2 nm on the digital and analog performance of UTBB SOI MOSFETs of 10 nm gate length with different ground plane (GP) structures under the double-gate (DG) operation-mode by numerical simulations. It is found that Si3N4 provides good digital and analog performance in terms of lower DIBL and higher voltage gain, Av. Meanwhile, GP-A structure which employed p+ doping under the source and drain regions beneath the BOX is able to provide not only high Av but also a stable gain throughout the frequency range as compared to other GP structures. Thus, the configuration of GP-A structure with Si3N4 as the high-k materials is proposed for the design of analog and RF circuits.
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高介电常数对不同接平面结构双栅极UTBB SOI mosfet数字模拟性能的影响
在这项工作中,我们通过数值模拟研究了在双栅极(DG)工作模式下,使用不同栅极介电材料(HfO2和Si3N4)与传统等效氧化厚度(EOT)为1.2 nm的SiO2相比,对10 nm栅极长度、不同接平面(GP)结构的UTBB SOI mosfet的数字和模拟性能的影响。发现Si3N4在较低的DIBL和较高的电压增益Av方面具有良好的数字和模拟性能。同时,与其他GP结构相比,在BOX下面的源极和漏极区掺杂p+的GP- a结构不仅能够提供高Av,而且在整个频率范围内具有稳定的增益。因此,提出了以Si3N4为高k材料的GP-A结构配置,用于模拟电路和射频电路的设计。
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