Numerical Analysis of Deformation and Thermal Behavior during Ultrasonic Al Ribbon Bonding

Shinji Suzuki, Y. Oyama, M. Maeda, Yasuo Takahashi
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引用次数: 5

Abstract

Ultrasonic bonding process for wiring an Al ribbon to electric pads on substrate is affected by ribbon deformation and thermal behavior, i.e., (temperature rise of the materials during bonding). In the present study, the deformation and thermal behavior are analyzed. Numerical simulations of temperature rise and the deformation of the ribbon (wiring materials) were carried out by finite difference and element methods, respectively. As a result, the temperature rise and deformation processes were visualized by graphic images. It was suggested that the temperature of ribbon rose up to greater than 373 K during bonding. The ribbon deformation and the frictional slip behaviors influenced each other. Ultrasonic vibration enhances the equivalent stress in the Al ribbon very largely.
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超声铝带键合变形及热行为的数值分析
铝带与衬底电垫片的超声波键合工艺受带变形和热行为的影响,即(键合过程中材料的温升)。在本研究中,分析了变形和热行为。采用有限差分法和单元法分别对带材(布线材料)的温升和变形进行了数值模拟。结果,温度上升和变形过程是可视化的图形图像。结果表明,在键合过程中,条带温度上升到373 K以上。带材变形与摩擦滑移行为相互影响。超声振动大大提高了铝带的等效应力。
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