Fast MSL analysis of microelectronic packages by using equal weight increasing method

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI:10.1109/ICEPT.2016.7583161

Zhixue Liu, Xiaosong Ma, Qiulin Ding, G. Zhang

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引用次数: 1

Abstract

With the wide application of microelectronics packaging products in the industry, the chip have been more and more attention in the harsh environment of high temperature, high humidity. Therefore how to rapidly deliver high reliability products to market has been one of the issues of concern in the microelectronics industry. However moisture sensitivity level (MSL) analysis in microelectronics packaging is one of the most time consuming problem. Thus it is important to study the mechanism and method of the analysis of moisture sensitivity and shorten the analysis time. In this paper the fast analysis of microelectronic package MS L is achieved by the approach of an equal weight of water increasing at different conditions by simulation. According to project requirements, the ESOP8 is chosen as experimental device. Further the model is established, which is used to calculate equal moisture weight increase, and 10 to 67 acceleration factors are obtained. The purpose of this paper is to realize MSL the fast reliability evaluation method for microelectronics packaging industry. Finally using ANS YS finite element simulation is for the calculation.

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用等增重法快速分析微电子封装的MSL

随着微电子封装产品在行业中的广泛应用，芯片在高温、高湿等恶劣环境下受到越来越多的关注。因此，如何将高可靠性产品快速推向市场已成为微电子工业关注的问题之一。然而，微电子封装中水分敏感等级(MSL)的分析是最耗时的问题之一。因此，研究水分敏感性分析的机理和方法，缩短分析时间具有重要意义。本文通过模拟，采用等重量水在不同条件下增加的方法，实现了微电子封装msl的快速分析。根据项目要求，选择ESOP8作为实验设备。在此基础上建立了计算等湿重增量的模型，得到了10 ~ 67个加速度因子。本文的目的是实现微电子封装行业快速可靠性评估方法MSL。最后利用ANS - YS有限元模拟进行了计算。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2016 17th International Conference on Electronic Packaging Technology (ICEPT)

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