Effects of atomic diffusion processes in Co-Cu multilayer granular films

D Bisero , G Bordin , M Minelli , F Ronconi , F Spizzo , A Baraldi , S Lizzit , G Paolucci , L Pareti , G Turilli
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引用次数: 1

Abstract

Co-Cu multilayer granular films deposited onto SiO2/Si substrates have been submitted to thermal treatments in scanning mode. Their magnetisation, resistance and magnetoresistance have been studied after applying two different heating rates. The analysis of experimental data points out that only with the lower heating rate the properties of the films are strongly modified. In this case, indeed, XPS measurements show the presence of interdiffusion between atomic species of the substrate and metallic species inside the film. XPS data are presented to show the modifications in composition and chemical environment produced by thermal treatments.

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Co-Cu多层颗粒膜中原子扩散过程的影响
将Co-Cu多层颗粒膜沉积在SiO2/Si衬底上,并在扫描模式下进行热处理。采用两种不同的加热速率对其磁化、电阻和磁阻进行了研究。实验数据分析表明,只有在较低的加热速率下,薄膜的性能才会发生明显的变化。在这种情况下,XPS测量确实显示了衬底的原子种类和薄膜内的金属种类之间相互扩散的存在。XPS数据显示了热处理后的成分和化学环境的变化。
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