A multistandard, multiband SoC with integrated BT, FM, WLAN radios and integrated power amplifier

2010 IEEE International Solid-State Circuits Conference - (ISSCC) Pub Date : 2010-03-18 DOI:10.1109/ISSCC.2010.5433962

Chungyeol P. Lee, A. Behzad, B. Marholev, V. Magoon, I. Bhatti, Dandan Li, Subhas Bothra, A. Afsahi, Dayo Ojo, R. Roufoogaran, Tom Li, Yuyu Chang, K. R. Rao, S. Au, Prasad Seetharam, K. Carter, J. Rael, Malcolm Macintosh, Bobby Lee, M. Rofougaran, R. Rofougaran, A. Hadji-Abdolhamid, M. Nariman, S. Khorram, S. Anand, E. Chien, Steve Wu, Carol Barrett, Lijun Zhang, A. Zolfaghari, H. Darabi, Ali Sarfaraz, B. Ibrahim, M. Gonikberg, Marcellus Forbes, Colin Fraser, Luis Gutierrez, Yury Gonikberg, M. Hafizi, Siukai Mak, Jesse Castaneda, Kimmer Kim, Zhenhua Liu, S. Bouras, Kevin Chien, V. Chandrasekhar, P. Chang, Edwin Li, Zhimin Zhao

{"title":"A multistandard, multiband SoC with integrated BT, FM, WLAN radios and integrated power amplifier","authors":"Chungyeol P. Lee, A. Behzad, B. Marholev, V. Magoon, I. Bhatti, Dandan Li, Subhas Bothra, A. Afsahi, Dayo Ojo, R. Roufoogaran, Tom Li, Yuyu Chang, K. R. Rao, S. Au, Prasad Seetharam, K. Carter, J. Rael, Malcolm Macintosh, Bobby Lee, M. Rofougaran, R. Rofougaran, A. Hadji-Abdolhamid, M. Nariman, S. Khorram, S. Anand, E. Chien, Steve Wu, Carol Barrett, Lijun Zhang, A. Zolfaghari, H. Darabi, Ali Sarfaraz, B. Ibrahim, M. Gonikberg, Marcellus Forbes, Colin Fraser, Luis Gutierrez, Yury Gonikberg, M. Hafizi, Siukai Mak, Jesse Castaneda, Kimmer Kim, Zhenhua Liu, S. Bouras, Kevin Chien, V. Chandrasekhar, P. Chang, Edwin Li, Zhimin Zhao","doi":"10.1109/ISSCC.2010.5433962","DOIUrl":null,"url":null,"abstract":"The growing occurrences of WLAN, BT, and FM on the same mobile device have created a demand for putting all three on the same die to save on die size, I/O count, BOM, and ultimately cost. Common blocks such as crystal oscillator, bandgap, and power management units can be easily shared. This paper presents a solution in which 802.11a/b/g WLAN, single-stream 11n (SSN) WLAN, BT, and FM subsystem and radio are integrated on a single die.","PeriodicalId":6418,"journal":{"name":"2010 IEEE International Solid-State Circuits Conference - (ISSCC)","volume":"128 1","pages":"454-455"},"PeriodicalIF":0.0000,"publicationDate":"2010-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"78","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE International Solid-State Circuits Conference - (ISSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2010.5433962","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 78

Abstract

The growing occurrences of WLAN, BT, and FM on the same mobile device have created a demand for putting all three on the same die to save on die size, I/O count, BOM, and ultimately cost. Common blocks such as crystal oscillator, bandgap, and power management units can be easily shared. This paper presents a solution in which 802.11a/b/g WLAN, single-stream 11n (SSN) WLAN, BT, and FM subsystem and radio are integrated on a single die.

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

一个多标准，多频段SoC集成了BT, FM, WLAN无线电和集成功率放大器

随着WLAN、BT和FM在同一移动设备上的出现越来越多，人们需要将这三者放在同一个芯片上，以节省芯片尺寸、I/O数量、BOM和最终成本。常见的块，如晶体振荡器，带隙和电源管理单元可以很容易地共享。本文提出了一种将802.11a/b/g WLAN、单流11n (SSN) WLAN、BT、FM子系统和无线电集成在一个芯片上的解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

2010 IEEE International Solid-State Circuits Conference - (ISSCC)

自引率

0.00%

发文量