{"title":"Polymer-Matrix Composites for Microelectronics","authors":"D. Chung","doi":"10.1201/9781420040975-6","DOIUrl":null,"url":null,"abstract":"Polymer-matrix composite materials for microelectronics are reviewed in terms of the science and applications. They include those with continuous and discontinuous fillers in the form of particles and fibres, as designed for high thermal conductivity, low thermal expansion, low dielectric constant, high/low electrical conductivity and electromagnetic interference shielding. Applications include heat sinks, housings, printed wiring boards, substrates, lids, die attach, encapsulation, interconnections and thermal interface materials.","PeriodicalId":20322,"journal":{"name":"Polymers & Polymer Composites","volume":null,"pages":null},"PeriodicalIF":2.1000,"publicationDate":"2000-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polymers & Polymer Composites","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1201/9781420040975-6","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, CHARACTERIZATION & TESTING","Score":null,"Total":0}
引用次数: 20
Abstract
Polymer-matrix composite materials for microelectronics are reviewed in terms of the science and applications. They include those with continuous and discontinuous fillers in the form of particles and fibres, as designed for high thermal conductivity, low thermal expansion, low dielectric constant, high/low electrical conductivity and electromagnetic interference shielding. Applications include heat sinks, housings, printed wiring boards, substrates, lids, die attach, encapsulation, interconnections and thermal interface materials.
期刊介绍：
Polymers & Polymer Composites provides a forum for the publication of expertly peer reviewed, international research into the following topics:
- Fibre reinforced and particulate filled plastics
- Engineering plastics
- Nanocomposites
- Polymers or polyblends intended for engineering use (including structural, load bearing electronic and electrical applications)
- Fibre reinforced and particulate filled plastics
- Structural adhesives
- Textile & wood fibres
- Biomaterials with a load bearing capacity, (including polymer based dental materials)
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