Ning Ge, Jarrid A. Wittkopf, S. Simske, S. Barcelo, R. Ionescu, D. Lazaroff, Kevin Dooley, A. Rogacs, H. Holder
{"title":"3D Monolithic Metal Orifice Plate for SERS Application: A Showcase of Low Cost MEMS Packaging","authors":"Ning Ge, Jarrid A. Wittkopf, S. Simske, S. Barcelo, R. Ionescu, D. Lazaroff, Kevin Dooley, A. Rogacs, H. Holder","doi":"10.1109/ECTC.2017.93","DOIUrl":null,"url":null,"abstract":"Electroplating is a low cost process where metal ionsin a solution are reduced by an applied electric field onto aconductive substrate. This process has been studied extensively, but is still critical for modern technology and R&D. In the HPinkjet printing business, electroplating is primarily used in themanufacturing the orifice plate (OP) for integrated print-headproducts. To extend the OP functionality, a novel cost-effectivethree-dimensional (3D) OP has been developed to addressnumerous micro-electro-mechanical systems (MEMS) applications, including surface enhanced Raman spectroscopy(SERS).","PeriodicalId":6557,"journal":{"name":"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)","volume":"1 1","pages":"937-942"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2017.93","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Electroplating is a low cost process where metal ionsin a solution are reduced by an applied electric field onto aconductive substrate. This process has been studied extensively, but is still critical for modern technology and R&D. In the HPinkjet printing business, electroplating is primarily used in themanufacturing the orifice plate (OP) for integrated print-headproducts. To extend the OP functionality, a novel cost-effectivethree-dimensional (3D) OP has been developed to addressnumerous micro-electro-mechanical systems (MEMS) applications, including surface enhanced Raman spectroscopy(SERS).
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