{"title":"Whitespace redistribution for thermal via insertion in 3D stacked ICs","authors":"E. Wong, S. Lim","doi":"10.1109/ICCD.2007.4601912","DOIUrl":null,"url":null,"abstract":"One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding styles between device layers impose certain restrictions to where thermal vias may be inserted. This paper presents a whitespace redistribution algorithm that takes bonding style into consideration to improve thermal via placement, which in turn reduces temperature.","PeriodicalId":6306,"journal":{"name":"2007 25th International Conference on Computer Design","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2007-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 25th International Conference on Computer Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.2007.4601912","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 15
Abstract
One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding styles between device layers impose certain restrictions to where thermal vias may be inserted. This paper presents a whitespace redistribution algorithm that takes bonding style into consideration to improve thermal via placement, which in turn reduces temperature.
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