F. Balon, P. Carazzetti, J. Weichart, Mohamed Elghazzali, M. Hoffmann
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引用次数: 1
Abstract
Advanced Packaging relies heavily on the use of organic/polymer films and mold wafers such as Fan-Out Wafer-Level-Packages (FOWLP). Processing of such wafers poses challenges, potentially resulting in a high contact resistance (Rc), yield loss, increased maintenance costs and low tool productivity. In this paper we focus on novel approaches how to overcome these challenges. It is shown that the combination of Atmospheric Batch Degas and Cooler Modules in connection with the latest generation of Arctic ICP Sputter Etch results in a throughput of more than 45wafers/hour, Etch Shields Kit Lifetime exceeding 30'000 wafers, low and stable Rc values in RDL/UBM processing.
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