Directly Determining the Coefficient of Thermal Expansion of High-power Light-emitting Diodes by Optical Coherence Tomography

T. Yeh, Chun-Yang Chou, Chun-Ying Huang, Y. Yao, Yi-Kai Haung, M. Tsai, Ya-Ju Lee
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Abstract

The coefficient of thermal expansion (CTE) is a physical quantity that indicates the thermal expansion value of a material upon heating. For advanced thermal management, the accurate and immediate determination of the CTE of packaging materials is gaining importance because the demand for high-power lighting-emitting diodes (LEDs) is currently increasing. In this study, we used optical coherence tomography (OCT) to measure the CTE of an InGaN-based (λ = 450 nm) high-power LED encapsulated in polystyrene resin. The distances between individual interfaces of the OCT images were observed and recorded to derive the instantaneous CTE of the packaged LED under different injected currents. The LED junction temperature at different injected currents was established with the forward voltage method. Most importantly, this work validates the hypothesis that OCT can provide an alternative way to directly and nondestructively determine the spatially resolved CTE of the packaged LED device, which offers significant advantages over traditional CTE measurement techniques.
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光学相干层析成像直接测定大功率发光二极管的热膨胀系数
热膨胀系数(CTE)是表示材料受热时热膨胀值的物理量。由于目前对大功率发光二极管(led)的需求正在增加,因此对于先进的热管理,准确和立即确定封装材料的CTE变得越来越重要。在这项研究中,我们使用光学相干断层扫描(OCT)测量了聚苯乙烯树脂封装的ingan基(λ = 450 nm)大功率LED的CTE。通过观察和记录OCT图像各界面之间的距离,得出不同注入电流下封装LED的瞬时CTE。采用正向电压法测定了不同注入电流下LED的结温。最重要的是,这项工作验证了OCT可以提供一种替代方法来直接和无损地确定封装LED器件的空间分辨CTE的假设,这比传统的CTE测量技术具有显着的优势。
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