The microanalysis of copper-coated diamond composite powders prepared by electroless plating

Abstract

Diamond-Cu matrix composite with high thermal conductivity and low coefficient of thermal expansion has been the high-performance thermal management materials. High-performance copper-coated diamond composite powders were successfully prepared using electroless plating at an appropriate bath temperature, pH value, copper ions concentration. The XRD results showed the coated Cu was highly pure with very little oxygen content. The SEM results that the particle size and surface roughness increased, with the increase of bath temperature, pH value, copper ions concentration separately. Finally, diamond-Cu composite powers with dense Cu coating and homogeneous Cu particles could be obtained under the optimum process conditions at the reaction temperature of 45 °C, pH value of 12.5 and copper ions concentration of 0.10 mol/L.