{"title":"Design and Implementation of a Novel Skull Vibration Sensing Module for Bone Conduction Microphone","authors":"Bo-Cheng You, Sung-Cheng Lo, Chun-Kai Chan, Hsien-Lung Ho, Shih-Chia Chiu, Guan-Hong Hsieh, W. Fang","doi":"10.1109/MEMS46641.2020.9056312","DOIUrl":null,"url":null,"abstract":"This study presents a packaged MEMS acoustic or air pressure sensing module (Fig. 1) to detect the skull vibration for bone conduction microphone (BCM) application. The proposed microphone design has two merits: (1) the packaged module (Fig. 1) enable the skull vibration detection using the MEMS sensor; (2) no sound port is required to remove the environmental and wind noise and to avoid the damage from dust and water (Fig. 1a). The device with the dimensions of $3.5\\times 2.65\\times 1.48\\ \\text{mm}^{3}$ is implemented using the packaging and assembly of existing MEMS sensor with polymer diaphragm and metal proof-mass. Measurements show the device has a sensitivity of −39.1dB/g, $\\text{THD} < 0.22\\ \\%$ at 1kHz, and ±5dB bandwidth for 100Hz∼6.7kHz. Frequency responses of different samples show good repeatability.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"4 1","pages":"118-121"},"PeriodicalIF":0.0000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMS46641.2020.9056312","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
This study presents a packaged MEMS acoustic or air pressure sensing module (Fig. 1) to detect the skull vibration for bone conduction microphone (BCM) application. The proposed microphone design has two merits: (1) the packaged module (Fig. 1) enable the skull vibration detection using the MEMS sensor; (2) no sound port is required to remove the environmental and wind noise and to avoid the damage from dust and water (Fig. 1a). The device with the dimensions of $3.5\times 2.65\times 1.48\ \text{mm}^{3}$ is implemented using the packaging and assembly of existing MEMS sensor with polymer diaphragm and metal proof-mass. Measurements show the device has a sensitivity of −39.1dB/g, $\text{THD} < 0.22\ \%$ at 1kHz, and ±5dB bandwidth for 100Hz∼6.7kHz. Frequency responses of different samples show good repeatability.