Subsurface damage mechanism of wafer thinning process revealed by molecular dynamics simulation

Abstract

Three-dimensional integrated circuit as an extension of the conventional two dimensional processes is viewed as the best choice to continue Moore's law. The extreme miniaturization of size and the complication combination of structure of 3-D integrated circuit make a higher request to the relevant technologies including wafer thinning. Be living in the process of finding the new principle of wafer thinning, a deeper understanding of the existing theory is absolutely necessary.