Epoxidized Percentage of CTBN (ECTBN) Double Bonds for the Application of Layering in Composite Industries and Insulation of Electronic Chips, Electrochemical Sensors

Abstract

Epoxidation os liquid carboxyl-terminated butadiene acrylonitrile (CTBN) rubber was done using hydrogen peroxide and Acetic acid, and different degrees of epoxidation was used to curing and harden the epoxy resin. Using H-NMR and also FTIR methods, Epoxy of the double resin bonds used was investigated. According to the data obtained from these two methods, some available dual links are epoxy and ready for use in the mentioned applications. The peaks appeared at 1070, and 1230 cm-1 in the FTIR spectrum of ECTBN are attributed to the epoxy groups. In the HNMR spectrum of CTBN, two new signals have appeared at 2.69 ppm and 2.93 ppm, which are attributed to the protons of epoxy groups with Cis and trans configurations, respectively. Epoxy resin has been used as an electrical insulator for burying electronic boards and insulating telecommunication components and electrochemical sensors (paste electrodes structure and screen printed electrodes) due to its properties such as high breakdown voltage resistance, water-resistance and resistance to chemicals, resistance to thermal and electrical shocks.