On-Wafer Graphene Devices for THz Applications Using a High-Yield Fabrication Process

P. Theofanopoulos, G. Trichopoulos
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引用次数: 5

Abstract

We characterize a novel fabrication procedure for the implementation of large arrays of subwavelength graphene devices. With the proposed process, we can now integrate graphene layers on large substrate areas (> 4 cm2) and implement thousands of devices with high-yield (> 90 %). Examples of such systems include broadband THz phased arrays and metasurfaces that can be used in THz imaging and sensing. Current nano-fabrication processes hinder the proliferation of large arrays due to the fragile nature of graphene. Conversely, we use titanium sacrificial layers to protect the delicate graphene throughout the fabrication process. Thus, we minimize graphene delamination and enable multiple devices on large-area substrates with high-yield. In addition, we present a series of on-wafer measurement results in the 220-330 GHz band, verifying the robustness of our fabrication process.
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使用高产量制造工艺的太赫兹应用的片上石墨烯器件
我们描述了一种新的制造过程,用于实现亚波长石墨烯器件的大阵列。利用所提出的工艺,我们现在可以将石墨烯层集成在大衬底面积(> 4 cm2)上,并实现数千个高产量(> 90%)的器件。这种系统的例子包括宽带太赫兹相控阵和可用于太赫兹成像和传感的超表面。由于石墨烯的易碎性,目前的纳米制造工艺阻碍了大型阵列的扩散。相反,我们在整个制造过程中使用钛牺牲层来保护脆弱的石墨烯。因此,我们最大限度地减少了石墨烯的分层,并使多个器件在大面积衬底上具有高成品率。此外,我们还提供了一系列220-330 GHz频段的片上测量结果,验证了我们制造工艺的稳健性。
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