L. Sudakov-Boreysha, A. Morgenshtein, U. Dinnar, Y. Nemirovsky
{"title":"ISFET CMOS compatible design and encapsulation challenges","authors":"L. Sudakov-Boreysha, A. Morgenshtein, U. Dinnar, Y. Nemirovsky","doi":"10.1109/ICECS.2004.1399736","DOIUrl":null,"url":null,"abstract":"This work presents the main challenges in ISFET encapsulation. It analyzes SU8 drawbacks as an encapsulant and presents a novel flip-chip bonding packaging concept.","PeriodicalId":38467,"journal":{"name":"Giornale di Storia Costituzionale","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2004-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Giornale di Storia Costituzionale","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICECS.2004.1399736","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Arts and Humanities","Score":null,"Total":0}
引用次数: 8
Abstract
This work presents the main challenges in ISFET encapsulation. It analyzes SU8 drawbacks as an encapsulant and presents a novel flip-chip bonding packaging concept.
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