Effects of thermal aging and electromigration on tensile strength of SnAgCu solder joints with different volume

G. Wang, L. Yin, Z. Yao, Jinzhao Wang
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引用次数: 1

Abstract

The effects of thermal aging and electromigration on the tensile strength and microstructure of SnAgCu micro-interconnection solder joints with different volume were discussed in this paper. The experimental results show that isothermal aging results in coarsening of the microstructure in the solder joint, and electromigration leads to micro-hole or micro-crack in the cathode interface, which bring about obvious degradation of tensile strength to the joints. The smaller volume of the micro-interconnection joint is, the less degradation of tensile strength for it, this is caused by the increasing mechanical constraint in the solder joints.
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热时效和电迁移对不同体积SnAgCu焊点抗拉强度的影响
研究了热时效和电迁移对不同体积SnAgCu微互连焊点抗拉强度和显微组织的影响。实验结果表明,等温时效导致焊点组织粗化,电迁移导致阴极界面出现微孔或微裂纹,导致焊点抗拉强度明显下降。微互连接头体积越小,其抗拉强度下降越小,这是由于焊点的机械约束增加所致。
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