Flexible thermal MEMS flow sensor based on Cu on polyimide substrate

S. Shibata, Yosuke Niimi, M. Shikida
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引用次数: 15

Abstract

A flexible thermal flow sensor based on a Cu on polyimide (COP) substrate was developed for the first time. It has an advantage in that it can be mounted on non-planar surfaces, and, through having a low resistance, it can embed an electrical feed into the COP substrate. Metal film working as a flow sensing element was formed on a thin polyimide membrane produced by sacrificial etching. Flow sensing characteristics, such as the calibration curve and response waveform, were successfully obtained. The relationship between the sensor output and flow rate closely matched the calibration curve derived by King's law. The obtained response times of both rising and falling were 0.50 s and 0.67 s, respectively.
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基于Cu -聚酰亚胺基板的柔性热MEMS流量传感器
首次研制了一种基于Cu - on -聚酰亚胺(COP)衬底的柔性热流传感器。它的优点在于它可以安装在非平面表面上,并且通过具有低电阻,它可以将电馈电嵌入COP基板中。在牺牲蚀刻法制备的聚酰亚胺薄膜上形成了作为流量传感元件的金属膜。成功地获得了流量传感特性,如校准曲线和响应波形。传感器输出与流量之间的关系与King定律导出的校准曲线非常吻合。得到的上升和下降的响应时间分别为0.50 s和0.67 s。
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