Mounting pollen on a thermoplastic adhesive for scanning electron microscopy

W. Chissoe, E. L. Vezey, J. Skvarla
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引用次数: 9

Abstract

A heat-sensitive adhesive, Tempfix?, developed for scanning electron microscopy of powders and small particles, provides consistently high-quality secondary imaging with a variety of pollen grain morphologies and preparation protocols. Tempfix" was used successfully under all combinations of these conditions: (1) pollen air-dried from ETOH or artificially dried; (2) pollen transferred to naked or sputter-coated Tempfix?; and (3) pollen transferred to solid (at room temperature) or tacky (40-43?C) Tempfix?. In contrast to other adhesives, Tempfix": (1) does not react with the dehydration fluid ethanol; (2) permits control of depth of pollen penetration into the adhesive; (3) provides a high pollen retention rate with both air-dried and artificially dried preparations; and (4) has a smooth glassy background. A critical element in many scanning electron microscopic (SEM) studies of pollen is the adhesive used to anchor grains to the specimen mount. Surprisingly, palynological adhesives have received relatively little attention. Frequently, they are unreported or only briefly noted in the materials-and-methods sections of pollen investigations. Adhesives for pollen grains are similar to those for other particulates; they include double-stick tape, rubber cement, silver paste, poly-L-lysine, glues, and waxes (Murphy, 1982). All of these, to some extent, yield inconsistent or undesirable results: charging (the buildup of electrons caused by inadequate sample grounding); sunken grains with halos attributable to partial embedment in the adhesive; grains with obscured surfaces caused by interaction of dehydrating solution with the adhesive; wrinkled, grainy, and uneven backgrounds owing to the nature and composition of the adhesive; and excessive loss of pollen grains caused by inadequate bonding with the adhesive. Recently, a thermoplastic adhesive, Tempfix?, was recommended as a mounting medium for small particles and powders in SEM (Marchese-Ragona et al., 1992). Because Tempfix? offered potential advantages over the adhesives listed above, particularly the ability to control the depth of sample penetration, we tested this adhesive using a variety of pollen grain sculpture patterns and SEM preparation techniques. MATERIALS AND METHODS Dry pollen was collected from herbarium specimens (Table I) and treated as outlined in Fig. 1. First, pollen was acetolyzed (10 min of boiling in a 9:1 mixture of acetic anhydride and sulfuric acid; Erdtman, 1960). All samples then were dehydrated through graded ethanol (ETOH) solutions to 100% ETOH, and then either (1) air-dried directly onto specimen mounts (Fig. 1: method TRANS. AM. MICROSC. Soc., 113(1): 72-79. 1994. ? Copyright, 1994, by the American Microscopical Society, Inc. This content downloaded from 157.55.39.243 on Wed, 05 Oct 2016 04:52:18 UTC All use subject to http://about.jstor.org/terms VOL. 113, NO. 1, JANUARY 1994
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将花粉装在扫描电子显微镜用的热塑性粘合剂上
一种热敏粘合剂,Tempfix?,用于粉末和小颗粒的扫描电子显微镜,提供一致的高质量的二次成像与各种花粉粒形态和制备方案。“Tempfix”在以下条件的所有组合下均成功使用:(1)花粉从ETOH中风干或人工干燥;(2)花粉转移到裸露的或溅射涂层的Tempfix?;(3)花粉转化为固体(室温)或粘性(40-43℃)的温度。与其他粘合剂相比,Tempfix":(1)不与脱水液乙醇发生反应;(2)可以控制花粉进入粘合剂的深度;(3)风干和人工干燥制剂均可提供高花粉保留率;(4)具有光滑的玻璃状背景。在许多花粉扫描电镜(SEM)研究中,一个关键因素是用于将颗粒固定在标本底座上的粘合剂。令人惊讶的是,孢粉粘接剂受到的关注相对较少。通常,它们未被报道或仅在花粉调查的材料和方法部分简要地注意到。花粉粒的黏合剂与其他颗粒的黏合剂相似;它们包括双粘胶带、橡胶水泥、银浆、聚l -赖氨酸、胶水和蜡(Murphy, 1982)。在某种程度上,所有这些都会产生不一致或不希望的结果:充电(由于样品接地不足引起的电子积聚);由于胶粘剂部分嵌入,颗粒凹陷,有光晕;由于脱水溶液与胶粘剂的相互作用,导致颗粒表面模糊;由于粘合剂的性质和成分造成的起皱、颗粒状和不均匀的背景;和花粉粒的过度损失,造成不充分的粘接胶。最近,一种热塑性胶粘剂Tempfix?被推荐作为SEM中小颗粒和粉末的安装介质(Marchese-Ragona et al., 1992)。因为Tempfix ?与上面列出的粘合剂相比,这种粘合剂具有潜在的优势,特别是控制样品渗透深度的能力,我们使用各种花粉颗粒雕刻模式和SEM制备技术对这种粘合剂进行了测试。材料和方法从植物标本馆标本中收集干花粉(表1),并按图1所示处理。首先,将花粉在9:1的乙酸酐和硫酸混合物中乙酰化(煮沸10分钟);Erdtman, 1960)。然后通过分级乙醇(ETOH)溶液将所有样品脱水至100% ETOH,然后(1)直接风干到样品架上(图1:TRANS方法)。点。MICROSC。Soc。生物医学工程学报,2013(1):72-79。1994. ? 版权所有,1994年,美国显微学会,Inc。此内容从157.55.39.243下载于星期三,2016年10月5日04:52:18 UTC所有使用须遵守http://about.jstor.org/terms卷113,NO。一九九四年一月一日
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