Numerical and Experimental Study of Fan-Out Wafer Level Package Strength

Abstract

Fan-out wafer level packaging technology becomes more attractive and popular in the semiconductor packaging industry. The fan-out wafer level package (FOWLP) has the feature of integrating various devices in a tiny form factor. Since the FOWLP size is compact and small, its package strength is critical to its reliability. In this work, the three-point bending test method and finite element method was used to evaluate the FOWLP strength. Two different structural FOWLP were built, and their numerical models were created. The results showed that the FOWLP experiment and simulation flexure strength results matched each other in the lower failure possibility area closely. However, the simulation results under-estimated the FOWLP failure possibility to compare with the experiment results in the upper failure possibility area.