Haoran Wen, Yaqiang Ji, Kai Zhang, M. Yuen, S. Lee, Xianzhu Fu, R. Sun, C. Wong
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引用次数: 0
Abstract
Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal performance is investigated by inserting the composite between Al blocks. The ratio of Cu filler is optimized to be 50% to achieve the lowest thermal resistance.
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