Designing the Topology of a Unipolar Pulsed-DC Power Supply using the Open-source Scilab/Xcos Software for a Low-cost Plasma Etcher

Samuel Husin Surya Mandala , Mochamad Januar , Bei Liu , Kou-Chen Liu
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Abstract

We proposed a design topology for a unipolar pulsed direct-current power supply to produce low-cost reactive plasma etcher system. The design was simulated by a block diagram method using the open-source software Scilab/Xcos, and the results were validated by prototyping the power supply. In the topology, the snubber circuit and the RLC circuit play a critical role in producing a smoother pulse waveform and regulating the characteristics of the plasma current. Their optimized parameters can provide well-controllable duty cycles in the voltage output of the power supply. Moreover, the effect of the duty cycles on the performance of the power supply is analyzed. We found that the duty cycle can adjust the transient response of the plasma current as well as the density of the plasma ions. This aspect is useful not only for reducing the arcing effect but also for modifying the surface wettability of the treated substrates. As a result, the glass substrates treated with a 100% duty cycle becomes more hydrophilic, while those treated with a 20% duty cycle tend to be more hydrophobic.

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基于开源Scilab/Xcos软件的低成本等离子体蚀刻器单极脉冲直流电源拓扑设计
我们提出了一种单极脉冲直流电源的设计拓扑,用于生产低成本的反应等离子体蚀刻系统。利用开源软件Scilab/Xcos对设计进行了方框图仿真,并通过电源样机验证了设计结果。在拓扑结构中,缓冲电路和RLC电路对产生更平滑的脉冲波形和调节等离子体电流特性起着至关重要的作用。它们的优化参数可以在电源输出电压中提供良好的可控占空比。此外,还分析了占空比对电源性能的影响。我们发现占空比可以调节等离子体电流的瞬态响应以及等离子体离子的密度。这一方面不仅可用于减少电弧效应,而且可用于修饰处理过的基材的表面润湿性。因此,100%占空比处理的玻璃基板变得更亲水,而20%占空比处理的玻璃基板往往更疏水。
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