An experimental comparison of interface trap density in hafnium oxide-based FeFETs

Abstract

In recent years, there has been significant progress in the development of high-$\kappa$ materials in the semiconductor industry. Given that the contact between the channel and the electrode has a crucial impact on reliability, the selection of electrode materials and their deposition technology is an area that requires extensive research. Additionally, interface trap density has long played a critical role in determining the reliability of field-effect transistors (FETs). Therefore, this paper presents the results of interface trap density in high-$\kappa$ FETs obtained using 2-level and 3-level charge pumping methods. Measurements were conducted on a 10 nm oxide thickness n-doped silicon substrate using native k materials such as silicon and zirconium-doped hafnium oxide. The results demonstrate that chlorine-based HfO2 oxide with zirconium doping exhibits the lowest interface defects.