Microstructures, Mechanical Properties and Electromagnetic Wave Absorption Performance of Porous SiC Ceramics by Direct Foaming Combined with Direct-Ink-Writing-Based 3D Printing.

IF 3.1 3区 材料科学 Q3 CHEMISTRY, PHYSICAL Materials Pub Date : 2023-04-04 DOI:10.3390/ma16072861
Jianqin Wu, Lu Zhang, Wenqing Wang, Ruyue Su, Xiong Gao, Suwen Li, Gang Wang, Rujie He
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引用次数: 3

Abstract

Direct-ink-writing (DIW)-based 3D-printing technology combined with the direct-foaming method provides a new strategy for the fabrication of porous materials. We herein report a novel method of preparing porous SiC ceramics using the DIW process and investigate their mechanical and wave absorption properties. We investigated the effects of nozzle diameter on the macroscopic shape and microstructure of the DIW SiC green bodies. Subsequently, the influences of the sintering temperature on the mechanical properties and electromagnetic (EM) wave absorption performance of the final porous SiC-sintered ceramics were also studied. The results showed that the nozzle diameter played an important role in maintaining the structure of the SiC green part. The printed products contained large amounts of closed pores with diameters of approximately 100-200 μm. As the sintering temperature increased, the porosity of porous SiC-sintered ceramics decreased while the compressive strength increased. The maximum open porosity and compressive strength were 65.4% and 7.9 MPa, respectively. The minimum reflection loss (RL) was -48.9 dB, and the maximum effective absorption bandwidth (EAB) value was 3.7 GHz. Notably, porous SiC ceramics after sintering at 1650 °C could meet the application requirements with a compressive strength of 7.9 MPa, a minimum RL of -27.1 dB, and an EAB value of 3.4 GHz. This study demonstrated the potential of direct foaming combined with DIW-based 3D printing to prepare porous SiC ceramics for high strength and excellent EM wave absorption applications.

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直接发泡结合直墨3D打印制备多孔SiC陶瓷的微观结构、力学性能及电磁波吸收性能
基于直接墨水书写(DIW)的3d打印技术与直接发泡技术相结合,为多孔材料的制备提供了一种新的策略。本文报道了一种利用DIW工艺制备多孔碳化硅陶瓷的新方法,并研究了其机械性能和吸波性能。研究了喷嘴直径对DIW碳化硅坯宏观形状和微观结构的影响。随后,研究了烧结温度对多孔sic烧结陶瓷的力学性能和电磁吸收性能的影响。结果表明,喷嘴直径对保持碳化硅绿件的组织有重要作用。打印出来的产品含有大量直径约为100-200 μm的封闭孔隙。随着烧结温度的升高,多孔sic烧结陶瓷的孔隙率降低,抗压强度增加。最大开孔率为65.4%,最大抗压强度为7.9 MPa。最小反射损耗(RL)为-48.9 dB,最大有效吸收带宽(EAB)为3.7 GHz。值得注意的是,1650℃烧结后的多孔SiC陶瓷,抗压强度为7.9 MPa,最小RL为-27.1 dB, EAB值为3.4 GHz,可以满足应用要求。这项研究证明了直接发泡与基于diw的3D打印相结合的潜力,可以制备出具有高强度和优异电磁波吸收应用的多孔SiC陶瓷。
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来源期刊
Materials
Materials MATERIALS SCIENCE, MULTIDISCIPLINARY-
CiteScore
5.80
自引率
14.70%
发文量
7753
审稿时长
1.2 months
期刊介绍: Materials (ISSN 1996-1944) is an open access journal of related scientific research and technology development. It publishes reviews, regular research papers (articles) and short communications. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. Therefore, there is no restriction on the length of the papers. The full experimental details must be provided so that the results can be reproduced. Materials provides a forum for publishing papers which advance the in-depth understanding of the relationship between the structure, the properties or the functions of all kinds of materials. Chemical syntheses, chemical structures and mechanical, chemical, electronic, magnetic and optical properties and various applications will be considered.
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