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引用次数: 1

摘要

只提供摘要形式。最近的器件发展和成就表明,未掺杂通道全耗尽SOI器件正在成为20nm及以下节点批量技术的重要替代方案。这些架构已被证明可以提供高驱动电流,同时确保低静态和动态功率。本文概述了完全枯竭技术提供的主要优势,以及需要解决的关键挑战。静电完整性、可驾驶性、可变性和可扩展性通过硅数据和TCAD分析来解决。平面架构的独特功能,如解决多VT挑战和非逻辑器件(ESD, I/ o)也被报道。
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MOSFETs transitions towards fully depleted architectures
Summary form only given. Recent device developments and achievements have demonstrated that undoped channel Fully depleted SOI devices are becoming a serious alternative to Bulk technologies for 20nm node and below. These architectures have proven that they can provide high drive current together with ensuring low static and dynamic power. This paper gives an overview of the main advantages provided by Fully Depleted technologies, as well as the key challenges that need to be addressed. Electrostatic integrity, drivability, variability and scalability are addressed through silicon data and TCAD analyses. Unique features of planar architectures such as solutions to the Multiple VT challenges and non logic devices (ESD, I/Os) are also reported.
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