Temperature distribution in a circular flux tube with arbitrary specified contact temperatures

Temperature profile of electronic devices is one of the key factors that should be considered for designing an effective thermal management system. In this paper, an analytical solution for temperature distribution of a circular flux tube is presented. The boundary conditions along the source plane are specified as arbitrary temperatures and adiabatic. The boundary condition along the sink plane is convective cooling and the boundary condition along the walls is adiabatic. For solving the governing equation, the method of separation of variables and the least squares method are used. A case study is presented and the results are compared with the Finite Element Method (FEM). This analytical solution helps thermal engineers to have a better understanding of the thermal behavior of electronic devices.