使用翅片掺杂的多vt finfet的性能和可变性

K. Akarvardar, C. Young, D. Veksler, K. Ang, I. Ok, M. Rodgers, V. Kaushik, S. Novak, J. Nadeau, M. Baykan, H. Madan, P. Hung, T. Ngai, H. Stamper, S. Bennett, D. Franca, M. Rao, S. Gausepohl, P. Majhi, C. Hobbs, P. Kirsch, R. Jammy
{"title":"使用翅片掺杂的多vt finfet的性能和可变性","authors":"K. Akarvardar, C. Young, D. Veksler, K. Ang, I. Ok, M. Rodgers, V. Kaushik, S. Novak, J. Nadeau, M. Baykan, H. Madan, P. Hung, T. Ngai, H. Stamper, S. Bennett, D. Franca, M. Rao, S. Gausepohl, P. Majhi, C. Hobbs, P. Kirsch, R. Jammy","doi":"10.1109/VLSI-TSA.2012.6210127","DOIUrl":null,"url":null,"abstract":"The impact of fin doping (B, P, As) on FinFET device parameters is studied for high-K/midgap metal gate SOI FinFETs. For a fin width of ~25 nm, >;1 V VT modulation is demonstrated from accumulation mode (AM) to inversion mode (IM). IM FinFETs improve short channel FinFET electrostatics, on-off ratio, and VT variability compared to their undoped counterparts. The same parameters degrade in accumulation mode FinFETs. A VT modulation of ±0.25 V using fin B and P doping comes at the expense of 24% and 14% high field mobility penalty for NFET and PFET, respectively. For the same dose, Arsenic is found to modulate the VT more effectively than does Phosphorus. Basic modeling results show that for aggressively scaled (5 nm-wide) fins, the impact of single dopant atom on VT can be as high as 25 mV, severely challenging the viability of the technique towards the end of roadmap.","PeriodicalId":388574,"journal":{"name":"Proceedings of Technical Program of 2012 VLSI Technology, System and Application","volume":"29 3","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Performance and variability in multi-VT FinFETs using fin doping\",\"authors\":\"K. Akarvardar, C. Young, D. Veksler, K. Ang, I. Ok, M. Rodgers, V. Kaushik, S. Novak, J. Nadeau, M. Baykan, H. Madan, P. Hung, T. Ngai, H. Stamper, S. Bennett, D. Franca, M. Rao, S. Gausepohl, P. Majhi, C. Hobbs, P. Kirsch, R. Jammy\",\"doi\":\"10.1109/VLSI-TSA.2012.6210127\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The impact of fin doping (B, P, As) on FinFET device parameters is studied for high-K/midgap metal gate SOI FinFETs. For a fin width of ~25 nm, >;1 V VT modulation is demonstrated from accumulation mode (AM) to inversion mode (IM). IM FinFETs improve short channel FinFET electrostatics, on-off ratio, and VT variability compared to their undoped counterparts. The same parameters degrade in accumulation mode FinFETs. A VT modulation of ±0.25 V using fin B and P doping comes at the expense of 24% and 14% high field mobility penalty for NFET and PFET, respectively. For the same dose, Arsenic is found to modulate the VT more effectively than does Phosphorus. Basic modeling results show that for aggressively scaled (5 nm-wide) fins, the impact of single dopant atom on VT can be as high as 25 mV, severely challenging the viability of the technique towards the end of roadmap.\",\"PeriodicalId\":388574,\"journal\":{\"name\":\"Proceedings of Technical Program of 2012 VLSI Technology, System and Application\",\"volume\":\"29 3\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-04-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of Technical Program of 2012 VLSI Technology, System and Application\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSI-TSA.2012.6210127\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of Technical Program of 2012 VLSI Technology, System and Application","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSI-TSA.2012.6210127","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10

摘要

研究了高k /中隙金属栅极SOI FinFET中掺杂(B, P, As)对器件参数的影响。当翅片宽度为~25 nm时,从累积模式(AM)到反转模式(IM)的VT调制> 1 V。与未掺杂的FinFET相比,IM FinFET改善了短通道FinFET的静电性能、通断比和VT可变性。相同的参数在积累模式的finfet中退化。使用fin B和P掺杂进行±0.25 V的VT调制,对NFET和pet分别造成24%和14%的高场迁移率损失。对于相同剂量,砷被发现比磷更有效地调节室速。基本的建模结果表明,对于大尺寸(5纳米宽)的鳍,单个掺杂原子对VT的影响可高达25 mV,严重挑战了该技术在路线图结束时的可行性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Performance and variability in multi-VT FinFETs using fin doping
The impact of fin doping (B, P, As) on FinFET device parameters is studied for high-K/midgap metal gate SOI FinFETs. For a fin width of ~25 nm, >;1 V VT modulation is demonstrated from accumulation mode (AM) to inversion mode (IM). IM FinFETs improve short channel FinFET electrostatics, on-off ratio, and VT variability compared to their undoped counterparts. The same parameters degrade in accumulation mode FinFETs. A VT modulation of ±0.25 V using fin B and P doping comes at the expense of 24% and 14% high field mobility penalty for NFET and PFET, respectively. For the same dose, Arsenic is found to modulate the VT more effectively than does Phosphorus. Basic modeling results show that for aggressively scaled (5 nm-wide) fins, the impact of single dopant atom on VT can be as high as 25 mV, severely challenging the viability of the technique towards the end of roadmap.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
MOSFETs transitions towards fully depleted architectures Performance and variability in multi-VT FinFETs using fin doping Comparison of differential and large-signal sensing scheme for subthreshold/superthreshold FinFET SRAM considering variability A high efficient and compact charge pump with multi-pillar vertical MOSFET Intrinsic MOSFET leakage of high-k peripheral DRAM devices: Measurement and simulation
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1