{"title":"回流炉局部焊料温度分布的计算","authors":"A. Yuile, S. Wiese","doi":"10.1109/ESTC.2018.8546452","DOIUrl":null,"url":null,"abstract":"This paper presents the application of computational fluid dynamics (CFD) in the area of electronics manufacturing technology. It focuses on the calculation of temperatures within the solder joint during reflow soldering process. The paper shows the advantages of simulation in determining temperatures that are difficult to obtain through experimental methods. Such methods should help to optimise reflow soldering processes in the electronics manufacturing industry.","PeriodicalId":198238,"journal":{"name":"2018 7th Electronic System-Integration Technology Conference (ESTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Calculation of local solder temperature profiles in reflow ovens\",\"authors\":\"A. Yuile, S. Wiese\",\"doi\":\"10.1109/ESTC.2018.8546452\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the application of computational fluid dynamics (CFD) in the area of electronics manufacturing technology. It focuses on the calculation of temperatures within the solder joint during reflow soldering process. The paper shows the advantages of simulation in determining temperatures that are difficult to obtain through experimental methods. Such methods should help to optimise reflow soldering processes in the electronics manufacturing industry.\",\"PeriodicalId\":198238,\"journal\":{\"name\":\"2018 7th Electronic System-Integration Technology Conference (ESTC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 7th Electronic System-Integration Technology Conference (ESTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2018.8546452\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 7th Electronic System-Integration Technology Conference (ESTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2018.8546452","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Calculation of local solder temperature profiles in reflow ovens
This paper presents the application of computational fluid dynamics (CFD) in the area of electronics manufacturing technology. It focuses on the calculation of temperatures within the solder joint during reflow soldering process. The paper shows the advantages of simulation in determining temperatures that are difficult to obtain through experimental methods. Such methods should help to optimise reflow soldering processes in the electronics manufacturing industry.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
