微波频率下厚膜介质的表征

B. Dziurdzia, J. Krupka, W. Gregorczyk
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引用次数: 1

摘要

本文介绍了光成像介质Fodel 6050的相对介电常数和介电损耗正切的精确测量结果。该测量方法使用分柱式介电谐振器,能够表征沉积在低损耗介电基片上的平面厚膜层的介电特性。使用频率分别为19.3 GHz和19.9 GHz的两个分裂介电后谐振器,对沉积在氧化铝和蓝宝石衬底上的两个Fodel薄膜进行了测量。
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Characterization of Thick-Film Dielectric at Microwave Frequencies
In this paper results of accurate measurements of relative permittivity and dielectric loss tangent of photoimageable dielectric Fodel 6050 has been presented. The measurement method uses a split-post dielectric resonator and enables characterisation of dielectric properties of planar thick-film layers deposited on low loss dielectric substrates. Measurements have been performed on two Fodel films deposited on alumina and sapphire substrates employing two split post dielectric resonators at frequencies 19.3 GHz and 19.9 GHz.
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