{"title":"板上倒装芯片(FCOB)工艺表征","authors":"S.M. Scheifers, C. Raleigh","doi":"10.1109/IEMT.1993.398208","DOIUrl":null,"url":null,"abstract":"A no clean flux process for flip chip on board is characterized for ionic flux residue and board contamination using a new cleanliness testing system. The benchmarking procedure establishes a correlation of flux residue to thermal shock reliability. Speciation and quantitation of ionic printed wiring board (PWB) constituents permits segregation of incoming board contamination from that caused by the flux. A process window to minimize defects and maximize reliability performance is developed. Methods for performing similar characterization and benchmarking of processes are presented.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"161 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Flip chip on board (FCOB) process characterization\",\"authors\":\"S.M. Scheifers, C. Raleigh\",\"doi\":\"10.1109/IEMT.1993.398208\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A no clean flux process for flip chip on board is characterized for ionic flux residue and board contamination using a new cleanliness testing system. The benchmarking procedure establishes a correlation of flux residue to thermal shock reliability. Speciation and quantitation of ionic printed wiring board (PWB) constituents permits segregation of incoming board contamination from that caused by the flux. A process window to minimize defects and maximize reliability performance is developed. Methods for performing similar characterization and benchmarking of processes are presented.<<ETX>>\",\"PeriodicalId\":206206,\"journal\":{\"name\":\"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium\",\"volume\":\"161 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-10-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1993.398208\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1993.398208","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Flip chip on board (FCOB) process characterization
A no clean flux process for flip chip on board is characterized for ionic flux residue and board contamination using a new cleanliness testing system. The benchmarking procedure establishes a correlation of flux residue to thermal shock reliability. Speciation and quantitation of ionic printed wiring board (PWB) constituents permits segregation of incoming board contamination from that caused by the flux. A process window to minimize defects and maximize reliability performance is developed. Methods for performing similar characterization and benchmarking of processes are presented.<>
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