超高压AlGaAs/InGaAs伪晶功率hemt

M. Kao, S. Fu, P. Ho, P. Smith, P. Chao, K. Nordheden, Sujane C. Wang
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引用次数: 11

摘要

本文报道了用于高压工作的双凹槽伪晶砷化镓高电子迁移率晶体管(hemt)的研制。栅极长度为0.25 μ m的gaas基功率HEMT的栅漏击穿电压为30伏,峰值g/sub /为510 mS/mm,最大电流密度为540 mA/mm。当漏极偏置到14伏时,400 μ m宽的HEMT在4.5 GHz下提供505 mW (1.26 W/mm)的输出功率。这是HEMT器件有史以来最高的输出功率密度和漏源工作电压。该器件在V/sub /=8V时也显示出出色的4.5 GHz和10 GHz功率性能组合(功率增益、功率密度、功率附加效率)。器件漏极偏置范围的显著扩大以及电流密度和击穿电压乘积的显著增加是采用反应离子蚀刻的沟道凹槽的结果。
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Very high voltage AlGaAs/InGaAs pseudomorphic power HEMTs
This paper reports the development of double recessed pseudomorphic GaAs High Electron Mobility Transistors (HEMTs) for high voltage operation. The GaAs-based power HEMT with 0.25 mu m gate-length exhibited a gate to drain breakdown voltage of 30 volts, a peak g/sub m/ of 510 mS/mm, and a maximum current density of 540 mA/mm. When biased to 14 volts on the drain, the 400 mu m wide HEMT delivered 505 mW (1.26 W/mm) output power at 4.5 GHz. This is the highest output power density and drain-source operating voltage ever reported for HEMT devices. The device also showed excellent 4.5 and 10 GHz power performance combination (power gain, power density, power-added efficiency) at V/sub ds/=8V. The significant extension of device drain bias range as well as increase in the product of current density and breakdown voltage were attributed to the adoption of channel recess using reactive ion etching.<>
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