{"title":"一种基于物理分析测试技术的假冒元器件识别方法","authors":"Zhengping Chen, Sujuan Zhang, Y. Qiu","doi":"10.1109/EDAPS.2017.8277025","DOIUrl":null,"url":null,"abstract":"With the rise of counterfeiting, and counterfeit electronic components are widely used in various field. Although the components used in the military equipment are through the layers of quality checks before installed, there are still a lot of counterfeit components do not be checked out. In this paper, an identification method for counterfeit components based on physical analysis test techniques, such as visual inspection, scanning acoustic microscope (SAM) and scanning electron microscope (SEM) examination, was proposed. And a case was applied and analyzed, which indicated that the proposed method can identify counterfeit devices effectively.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"111 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"An identification method of counterfeit components based on physical analysis test technology\",\"authors\":\"Zhengping Chen, Sujuan Zhang, Y. Qiu\",\"doi\":\"10.1109/EDAPS.2017.8277025\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With the rise of counterfeiting, and counterfeit electronic components are widely used in various field. Although the components used in the military equipment are through the layers of quality checks before installed, there are still a lot of counterfeit components do not be checked out. In this paper, an identification method for counterfeit components based on physical analysis test techniques, such as visual inspection, scanning acoustic microscope (SAM) and scanning electron microscope (SEM) examination, was proposed. And a case was applied and analyzed, which indicated that the proposed method can identify counterfeit devices effectively.\",\"PeriodicalId\":329279,\"journal\":{\"name\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"volume\":\"111 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2017.8277025\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2017.8277025","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An identification method of counterfeit components based on physical analysis test technology
With the rise of counterfeiting, and counterfeit electronic components are widely used in various field. Although the components used in the military equipment are through the layers of quality checks before installed, there are still a lot of counterfeit components do not be checked out. In this paper, an identification method for counterfeit components based on physical analysis test techniques, such as visual inspection, scanning acoustic microscope (SAM) and scanning electron microscope (SEM) examination, was proposed. And a case was applied and analyzed, which indicated that the proposed method can identify counterfeit devices effectively.