V. Baranov, V. Emelyanov, A. F. Kerentsev, D. Anufriev
{"title":"电力电子器件压制材料和封装条件选择标准","authors":"V. Baranov, V. Emelyanov, A. F. Kerentsev, D. Anufriev","doi":"10.1109/POLYTR.2005.1596506","DOIUrl":null,"url":null,"abstract":"Some design and technological restrictions of using known press-materials and packaging methods within package technology of power electron devices in the epoxy molded housings of ISOWATT-218 type have been examined. The results of experimental research of the device hermetic condition after their testing at high temperatures and humidity have been described. It is shown that a value of the housing thermal resistance for a certain press-material depends on process conditions, in particular depends on a velocity of the press-material injection into a form through founding channels. It has been discovered that the bigger diaphragm diameter (leading to increasing the velocity of the press-material injection into all parts of a press-form) leads to increase of the value of RT. Dependencies have a nonlinear character. The level of RTvalue depends on a press-material type. The conditions of packaging process with RTvalues of 2,5 - 3 °C / W have been founded for the press-materials MG-40F and EME 596. Decrease of an anti-adhesive grease that contains in the Russian press-material of MEP-5T type as well as the press-tablets prior heating exclusion leads to better quality of the plastic housing process formation.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"58 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Selection criteria of press-materials and packaging conditions for power electron devices\",\"authors\":\"V. Baranov, V. Emelyanov, A. F. Kerentsev, D. Anufriev\",\"doi\":\"10.1109/POLYTR.2005.1596506\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Some design and technological restrictions of using known press-materials and packaging methods within package technology of power electron devices in the epoxy molded housings of ISOWATT-218 type have been examined. The results of experimental research of the device hermetic condition after their testing at high temperatures and humidity have been described. It is shown that a value of the housing thermal resistance for a certain press-material depends on process conditions, in particular depends on a velocity of the press-material injection into a form through founding channels. It has been discovered that the bigger diaphragm diameter (leading to increasing the velocity of the press-material injection into all parts of a press-form) leads to increase of the value of RT. Dependencies have a nonlinear character. The level of RTvalue depends on a press-material type. The conditions of packaging process with RTvalues of 2,5 - 3 °C / W have been founded for the press-materials MG-40F and EME 596. Decrease of an anti-adhesive grease that contains in the Russian press-material of MEP-5T type as well as the press-tablets prior heating exclusion leads to better quality of the plastic housing process formation.\",\"PeriodicalId\":436133,\"journal\":{\"name\":\"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics\",\"volume\":\"58 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-10-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/POLYTR.2005.1596506\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/POLYTR.2005.1596506","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Selection criteria of press-materials and packaging conditions for power electron devices
Some design and technological restrictions of using known press-materials and packaging methods within package technology of power electron devices in the epoxy molded housings of ISOWATT-218 type have been examined. The results of experimental research of the device hermetic condition after their testing at high temperatures and humidity have been described. It is shown that a value of the housing thermal resistance for a certain press-material depends on process conditions, in particular depends on a velocity of the press-material injection into a form through founding channels. It has been discovered that the bigger diaphragm diameter (leading to increasing the velocity of the press-material injection into all parts of a press-form) leads to increase of the value of RT. Dependencies have a nonlinear character. The level of RTvalue depends on a press-material type. The conditions of packaging process with RTvalues of 2,5 - 3 °C / W have been founded for the press-materials MG-40F and EME 596. Decrease of an anti-adhesive grease that contains in the Russian press-material of MEP-5T type as well as the press-tablets prior heating exclusion leads to better quality of the plastic housing process formation.