电力电子器件压制材料和封装条件选择标准

V. Baranov, V. Emelyanov, A. F. Kerentsev, D. Anufriev
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引用次数: 1

摘要

研究了ISOWATT-218型环氧模压外壳中电力电子器件封装技术中使用已知压制材料和封装方法的设计和工艺限制。介绍了在高温、高湿条件下对该装置密封状态的实验研究结果。结果表明,某一压制材料的壳体热阻值取决于工艺条件,特别是取决于压制材料通过铸造通道注入成形的速度。研究发现,膜片直径越大(导致压料注射到压型各部分的速度增加),rt值也随之增加。RTvalue的水平取决于压料类型。为压制材料MG-40F和EME 596建立了rt2、5 ~ 3°C / W的封装条件。减少俄罗斯MEP-5T型压片材料中含有的抗粘脂,以及压片在加热前的排除,可以提高塑料外壳工艺形成的质量。
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Selection criteria of press-materials and packaging conditions for power electron devices
Some design and technological restrictions of using known press-materials and packaging methods within package technology of power electron devices in the epoxy molded housings of ISOWATT-218 type have been examined. The results of experimental research of the device hermetic condition after their testing at high temperatures and humidity have been described. It is shown that a value of the housing thermal resistance for a certain press-material depends on process conditions, in particular depends on a velocity of the press-material injection into a form through founding channels. It has been discovered that the bigger diaphragm diameter (leading to increasing the velocity of the press-material injection into all parts of a press-form) leads to increase of the value of RT. Dependencies have a nonlinear character. The level of RTvalue depends on a press-material type. The conditions of packaging process with RTvalues of 2,5 - 3 °C / W have been founded for the press-materials MG-40F and EME 596. Decrease of an anti-adhesive grease that contains in the Russian press-material of MEP-5T type as well as the press-tablets prior heating exclusion leads to better quality of the plastic housing process formation.
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