{"title":"基于热压印和抛光工艺的PMMA可动微结构高效制造工艺研究","authors":"Satoshi Amava, D. Dao, S. Sugiyama","doi":"10.1109/MHS.2009.5351742","DOIUrl":null,"url":null,"abstract":"This paper reports our study on an efficient fabrication process for polymer microstructures utilizing hot embossing and polishing. In this paper, PMMA micro movable structures are set as the target. First, a silicon mold is fabricated by bulk micromachining technology. Next, PMMA microstructures are formed on PMMA plate by hot embossing process. Then, the hot-embossed structures are bonded to a PMMA substrate, and the backside layer of the hot-embossed PMMA structure that remained after hot embossing is removed by polishing to release the movable structures. PMMA movable microstructures with line and space of 10 µm and 5 µm, respectively, and the thickness of about 60 µm have been fabricated successfully. This is a low-cost and highly efficient method to fabricate polymer MEMS devices.","PeriodicalId":344667,"journal":{"name":"2009 International Symposium on Micro-NanoMechatronics and Human Science","volume":"59 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Study on an efficient fabrication process for PMMA movable microstructures based on hot embossing and polishing processes\",\"authors\":\"Satoshi Amava, D. Dao, S. Sugiyama\",\"doi\":\"10.1109/MHS.2009.5351742\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper reports our study on an efficient fabrication process for polymer microstructures utilizing hot embossing and polishing. In this paper, PMMA micro movable structures are set as the target. First, a silicon mold is fabricated by bulk micromachining technology. Next, PMMA microstructures are formed on PMMA plate by hot embossing process. Then, the hot-embossed structures are bonded to a PMMA substrate, and the backside layer of the hot-embossed PMMA structure that remained after hot embossing is removed by polishing to release the movable structures. PMMA movable microstructures with line and space of 10 µm and 5 µm, respectively, and the thickness of about 60 µm have been fabricated successfully. This is a low-cost and highly efficient method to fabricate polymer MEMS devices.\",\"PeriodicalId\":344667,\"journal\":{\"name\":\"2009 International Symposium on Micro-NanoMechatronics and Human Science\",\"volume\":\"59 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 International Symposium on Micro-NanoMechatronics and Human Science\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MHS.2009.5351742\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 International Symposium on Micro-NanoMechatronics and Human Science","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MHS.2009.5351742","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Study on an efficient fabrication process for PMMA movable microstructures based on hot embossing and polishing processes
This paper reports our study on an efficient fabrication process for polymer microstructures utilizing hot embossing and polishing. In this paper, PMMA micro movable structures are set as the target. First, a silicon mold is fabricated by bulk micromachining technology. Next, PMMA microstructures are formed on PMMA plate by hot embossing process. Then, the hot-embossed structures are bonded to a PMMA substrate, and the backside layer of the hot-embossed PMMA structure that remained after hot embossing is removed by polishing to release the movable structures. PMMA movable microstructures with line and space of 10 µm and 5 µm, respectively, and the thickness of about 60 µm have been fabricated successfully. This is a low-cost and highly efficient method to fabricate polymer MEMS devices.