基于热压印和抛光工艺的PMMA可动微结构高效制造工艺研究

Satoshi Amava, D. Dao, S. Sugiyama
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引用次数: 2

摘要

本文报道了一种利用热压印和抛光技术制备聚合物微结构的高效工艺。本文以PMMA微活动结构为研究对象。首先,采用本体微加工技术制备硅模具。其次,通过热压成型工艺在PMMA板上形成PMMA微结构。然后,将热压结构粘合到PMMA基板上,并通过抛光去除热压后保留的热压PMMA结构的背面层,以释放可移动结构。成功制备出线距为10µm、间距为5µm、厚度约为60µm的PMMA可动微结构。这是一种低成本、高效率的制造聚合物MEMS器件的方法。
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Study on an efficient fabrication process for PMMA movable microstructures based on hot embossing and polishing processes
This paper reports our study on an efficient fabrication process for polymer microstructures utilizing hot embossing and polishing. In this paper, PMMA micro movable structures are set as the target. First, a silicon mold is fabricated by bulk micromachining technology. Next, PMMA microstructures are formed on PMMA plate by hot embossing process. Then, the hot-embossed structures are bonded to a PMMA substrate, and the backside layer of the hot-embossed PMMA structure that remained after hot embossing is removed by polishing to release the movable structures. PMMA movable microstructures with line and space of 10 µm and 5 µm, respectively, and the thickness of about 60 µm have been fabricated successfully. This is a low-cost and highly efficient method to fabricate polymer MEMS devices.
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