用FC-72和FC-84进行喷雾冷却实验研究以了解体积通量模型(VFM)的有效性

2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Pub Date : 2017-09-01 DOI:10.1109/THERMINIC.2017.8233787

Çağn Balıkçı, İlker Tan

{"title":"用FC-72和FC-84进行喷雾冷却实验研究以了解体积通量模型(VFM)的有效性","authors":"Çağn Balıkçı, İlker Tan","doi":"10.1109/THERMINIC.2017.8233787","DOIUrl":null,"url":null,"abstract":"Spray cooling for electronics cooling applications offers superior performance due to the atomization and two-phase flow abilities. Need for spray cooling in thermal applications is on the rise due to increasing heat fluxes and demanding reliability specifications. Unfortunately, it is a very laborious task to predict Critical Heat Fluxes (CHF) for spray cooling by means of Computational Fluid Dynamics (CFD). Therefore, thermal engineers generally prefer using empirical correlations to determine capabilities of spray cooling for electronics. In this study, one of the empirical correlations was tested by performing several experiments by varying the fluid type, the angle of spray nozzle and the flow rate.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"96 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Experimental spray cooling studies with FC-72 and FC-84 to comprehend the validity of volumetric flux model (VFM)\",\"authors\":\"Çağn Balıkçı, İlker Tan\",\"doi\":\"10.1109/THERMINIC.2017.8233787\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Spray cooling for electronics cooling applications offers superior performance due to the atomization and two-phase flow abilities. Need for spray cooling in thermal applications is on the rise due to increasing heat fluxes and demanding reliability specifications. Unfortunately, it is a very laborious task to predict Critical Heat Fluxes (CHF) for spray cooling by means of Computational Fluid Dynamics (CFD). Therefore, thermal engineers generally prefer using empirical correlations to determine capabilities of spray cooling for electronics. In this study, one of the empirical correlations was tested by performing several experiments by varying the fluid type, the angle of spray nozzle and the flow rate.\",\"PeriodicalId\":317847,\"journal\":{\"name\":\"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"volume\":\"96 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/THERMINIC.2017.8233787\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/THERMINIC.2017.8233787","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

喷雾冷却为电子冷却应用提供优越的性能，由于雾化和两相流能力。由于热通量的增加和可靠性规格的要求，热应用中喷雾冷却的需求正在上升。然而，利用计算流体力学(CFD)来预测喷雾冷却的临界热通量(CHF)是一项非常困难的任务。因此，热工程师通常更喜欢使用经验相关性来确定电子设备的喷雾冷却能力。在本研究中，通过改变流体类型、喷嘴角度和流量进行了多次实验，验证了其中一种经验相关性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Experimental spray cooling studies with FC-72 and FC-84 to comprehend the validity of volumetric flux model (VFM)

Spray cooling for electronics cooling applications offers superior performance due to the atomization and two-phase flow abilities. Need for spray cooling in thermal applications is on the rise due to increasing heat fluxes and demanding reliability specifications. Unfortunately, it is a very laborious task to predict Critical Heat Fluxes (CHF) for spray cooling by means of Computational Fluid Dynamics (CFD). Therefore, thermal engineers generally prefer using empirical correlations to determine capabilities of spray cooling for electronics. In this study, one of the empirical correlations was tested by performing several experiments by varying the fluid type, the angle of spray nozzle and the flow rate.

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2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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