用于SWIR成像应用的InGaAs红外探测器的开发

F. Rutz, P. Kleinow, R. Aidam, W. Bronner, L. Kirste, M. Walther
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引用次数: 12

摘要

本文报道了基于InGaAs - p-i-n和雪崩光电二极管(APDs)的短波红外探测器的材料和技术进展。利用分子束外延技术生长具有突变界面的薄层(这是优化APD结构所必需的),在3英寸InP衬底上生长的探测器结构获得了优异的晶体质量。对于焦平面探测器阵列的制作,我们采用了台面刻蚀技术,以便与常用的平面刻蚀技术的结果进行比较。相机探测器阵列以及具有各种尺寸和几何形状的材料和工艺表征的测试结构使用干蚀刻平台技术进行处理。介绍了该工艺发展的各个方面,并测量了探测器器件的暗电流和光电流特性。
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InGaAs infrared detector development for SWIR imaging applications
We report on materials and technology development for short-wave infrared photodetectors based on InGaAs p-i-n and avalanche photodiodes (APDs). Using molecular beam epitaxy for the growth of thin layers with abrupt interfaces, which are required for optimized APD structures, excellent crystalline quality has been achieved for detector structures grown on 3-inch InP substrates. For the fabrication of focal plane detector arrays, we employed a mesa etching technology in order to compare the results with the commonly utilized planar technology. Camera detector arrays as well as test structures with various sizes and geometries for materials and process characterization are processed using a dry-etch mesa technology. Aspects of the process development are presented along with measured dark-current and photo-current characteristics of the detector devices.
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