芯片结构屏蔽外壳的电磁建模

Qing Xu, M. Tong
{"title":"芯片结构屏蔽外壳的电磁建模","authors":"Qing Xu, M. Tong","doi":"10.1109/EDAPS.2017.8277044","DOIUrl":null,"url":null,"abstract":"Electromagnetic compatibility (EMC) design for chip structures requires an accurate electromagnetic (EM) modeling and analysis for involved shielding enclosures which are usually made of conductors. The shielding effectiveness of the enclosure can be evaluated through solving for the electric field inside the enclosure. Traditionally, the problem can be solved by the method of moments (MoM) in integral equation approach, but we propose a Nyström scheme to solve it. The Nyström scheme has several merits compared to the MoM, but it has not been used to analyze the EMC problems with very thin conductors. A numerical example is presented to demonstrate the scheme and good results have been obtained.","PeriodicalId":329279,"journal":{"name":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Electromagnetic modeling of shielding enclosure for chip structures\",\"authors\":\"Qing Xu, M. Tong\",\"doi\":\"10.1109/EDAPS.2017.8277044\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Electromagnetic compatibility (EMC) design for chip structures requires an accurate electromagnetic (EM) modeling and analysis for involved shielding enclosures which are usually made of conductors. The shielding effectiveness of the enclosure can be evaluated through solving for the electric field inside the enclosure. Traditionally, the problem can be solved by the method of moments (MoM) in integral equation approach, but we propose a Nyström scheme to solve it. The Nyström scheme has several merits compared to the MoM, but it has not been used to analyze the EMC problems with very thin conductors. A numerical example is presented to demonstrate the scheme and good results have been obtained.\",\"PeriodicalId\":329279,\"journal\":{\"name\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"volume\":\"2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2017.8277044\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2017.8277044","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

芯片结构的电磁兼容性(EMC)设计需要对所涉及的屏蔽外壳(通常由导体制成)进行精确的电磁(EM)建模和分析。通过求解箱体内电场,可以评价箱体的屏蔽效果。传统上,该问题可以用积分方程中的矩量法(MoM)来解决,但我们提出了一个Nyström方案来解决该问题。Nyström方案与MoM方案相比有许多优点,但尚未用于分析超薄导体的电磁兼容问题。最后通过一个算例对该方案进行了验证,取得了良好的效果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Electromagnetic modeling of shielding enclosure for chip structures
Electromagnetic compatibility (EMC) design for chip structures requires an accurate electromagnetic (EM) modeling and analysis for involved shielding enclosures which are usually made of conductors. The shielding effectiveness of the enclosure can be evaluated through solving for the electric field inside the enclosure. Traditionally, the problem can be solved by the method of moments (MoM) in integral equation approach, but we propose a Nyström scheme to solve it. The Nyström scheme has several merits compared to the MoM, but it has not been used to analyze the EMC problems with very thin conductors. A numerical example is presented to demonstrate the scheme and good results have been obtained.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Signal and power integrity (SI/PI) analysis of heterogeneous integration using embedded multi-die interconnect bridge (EMIB) technology for high bandwidth memory (HBM) Study on a Poisson's equation solver based on deep learning technique Filtering balanced-to-single-ended power divider with arbitrary power division ratio FDTD modeling of reconfigurable reflectarray for generation of vortex radio waves High performance balanced-to-unbalanced filtering power divider
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1