{"title":"晶圆级芯片规模封装中硅裂纹的根本原因识别","authors":"Mary Grace C. Raborar, Jae Saladar, R. Mendaros","doi":"10.1109/IPFA.2018.8452606","DOIUrl":null,"url":null,"abstract":"A different kind of challenge was encountered during the failure analysis (FA) of several customer-returned power devices. Determination of the failure mechanism (FM), silicon cratering or cracking, was straightforward; however, root cause process ownership identification was challenging. This paper presents the laborious analyses to identify the process that induced the failure.","PeriodicalId":382811,"journal":{"name":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Silicon Crack Root Cause Identification in a Wafer Level Chip Scale Package\",\"authors\":\"Mary Grace C. Raborar, Jae Saladar, R. Mendaros\",\"doi\":\"10.1109/IPFA.2018.8452606\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A different kind of challenge was encountered during the failure analysis (FA) of several customer-returned power devices. Determination of the failure mechanism (FM), silicon cratering or cracking, was straightforward; however, root cause process ownership identification was challenging. This paper presents the laborious analyses to identify the process that induced the failure.\",\"PeriodicalId\":382811,\"journal\":{\"name\":\"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"64 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2018.8452606\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2018.8452606","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Silicon Crack Root Cause Identification in a Wafer Level Chip Scale Package
A different kind of challenge was encountered during the failure analysis (FA) of several customer-returned power devices. Determination of the failure mechanism (FM), silicon cratering or cracking, was straightforward; however, root cause process ownership identification was challenging. This paper presents the laborious analyses to identify the process that induced the failure.
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