Y. Zhou, J. Hajjar, S. Parthasarathy, D. Clarke, Brian Moane
{"title":"Spice中的系统级Esd仿真:一种整体方法","authors":"Y. Zhou, J. Hajjar, S. Parthasarathy, D. Clarke, Brian Moane","doi":"10.23919/EOS/ESD.2018.8509784","DOIUrl":null,"url":null,"abstract":"Compliance to system-level ESD robustness at the product level is increasingly becoming a competitive advantage. Predicting the classification test level of a design prior to fabrication is critical in achieving first pass success and also addressing key concerns in this regards. Compact models and a simulation platform have been developed to predict system-level ESD robustness.","PeriodicalId":328499,"journal":{"name":"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"System Level Esd Simulation In Spice: A Holistic Approach\",\"authors\":\"Y. Zhou, J. Hajjar, S. Parthasarathy, D. Clarke, Brian Moane\",\"doi\":\"10.23919/EOS/ESD.2018.8509784\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Compliance to system-level ESD robustness at the product level is increasingly becoming a competitive advantage. Predicting the classification test level of a design prior to fabrication is critical in achieving first pass success and also addressing key concerns in this regards. Compact models and a simulation platform have been developed to predict system-level ESD robustness.\",\"PeriodicalId\":328499,\"journal\":{\"name\":\"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-09-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/EOS/ESD.2018.8509784\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/EOS/ESD.2018.8509784","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
System Level Esd Simulation In Spice: A Holistic Approach
Compliance to system-level ESD robustness at the product level is increasingly becoming a competitive advantage. Predicting the classification test level of a design prior to fabrication is critical in achieving first pass success and also addressing key concerns in this regards. Compact models and a simulation platform have been developed to predict system-level ESD robustness.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
