基于多目标优化的半导体晶圆制造调度

Zuntong Wang, F. Qiao, Qidi Wu
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引用次数: 2

摘要

CPC是一种用于半导体晶圆制造调度的复合优先级控制策略。硅片的复合优先级是根据硅片当前的处理步骤,计算当前步骤缓冲区、上游步骤缓冲区和下游步骤缓冲区中等待处理的硅片的数量。具有最高复合优先级的晶圆被分配到特定的机器进行处理。与常用调度策略相比,CPC策略在减少在制品总量、降低周期时间及其标准差、提高吞吐率等方面表现出较高的性能
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Scheduling Semiconductor Wafer Fabrication with Optimization of Multiple objectives
CPC is a compound priority control strategy used for scheduling semiconductor wafer fabrication. The compound priority of wafers is calculated according to their current processing step, to the amount of wafers waiting for processing in current step buffer, in upstream step buffer, and in downstream step buffer. Wafers with the highest compound priority are dispatched to certain machine to be processed. Compared to common used scheduling strategies, CPC strategy exhibits high performance in reducing total amount of WIP, decreasing cycle time and its standard deviation, and increasing the throughput rate
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